Mikrotek Machines Ltd.


Amruth Nagar Main Rd , 16
Bangalore, Karnataka -
India ()
Tel: 00 9180 42688999
Fax: +91 80 23621769
Contact person:

Product and/or service specifications

Diamond die polishing equipment


Product categories: Various machines and accessories 

Diamond die polishing equipment

Diamond Die Polishing Equipment

1.Semi Automatic Polishing Machine USBNG 250/300

These machines are designed and developed for resizing and repolishing of Polycrystalline, Natural & Mono diamond dies.
The machine mainly consists of ultrasonic generator, rotating ultrasonic head, Oscillating die table and built in needle grinder. Needle fixing is by soldering for optimum transfer of ultrasonic power. The die up and down movement is motorized. The die pressure is magnetic.

The speciality of the machine is that accurate die angles can be produced. The frequency and the amplitude of the ultrasonic waves can be varied. The machine can also be used for working round and conical holes of Tungsten carbide, ceramic and hard metals.
The machine is supplied with a set of spare parts and standard accessories which make the machine ready to use.

2. Ultrasonic Die Polishing Machines USM 150/250/300

These machines are designed and developed for resizing and repolishing of Polycrystalline, Natural & Mono diamond dies. The simple and manually operated ultrasonic machine consists of an ultrasonic generator, drilling head and die table. Drilling head assembly consists of a sandwich type piezo ceramic transducer, which produces fine and continuous ultrasonic power. Ultrasonic head up and down movement is by rack and pinion mechanism. Die table assembly is with counter weight balance.

3. Wire Polishing Machine - WPA1S, 2S & 3S

These machines are designed and developed for resizing and repolishing of Polycrystalline, Natural and Mono Diamond dies.

The machine is manufactured with precision engineering and especially consists of self cantering type oscillating die holder and reciprocating wire clamping device. Die rotation and stroke speeds are continuously variable. All operations are controlled by electronic timer with digital display. Spindle and stroke motors are controlled through AC drives.

The model WPA2S and 3S is having same features as WPA1S but with independently controlled spindles.

4.- Wire Polishing Machine – WPAB1S


This machine is designed and developed for sizing and polishing of polycrystalline, natural and Mono diamond dies of size range from 0.100mm to 10.00mm. The machine is specially designed for the RBD sizes of range 2.500 mm to 10.00 mm.

The Machine is manufactured with precision engineering and especially consists of self centering oscillating type die holder and reciprocating wire clamping device. Die rotation and stroke speeds are continuously variable. Individual controls are provided for die rotation, stroke and oscillation. All operations are controlled by electronic timer with digital display especially spindle and stroke motors are operating through Japanese make AC drives. To speed up the working of RBD dies, a special feature to exert side pressure on the die is provided.