Extrusion technology reaching new heights: Maillefer novelties at wire India 2018

After participating in China's No. 1 for the wire and cable industries - wire China in Shanghai - Maillefer Extrusion Oy is preparing to exhibit at the 7th edition of wire India in Mumbai, on November 27 - 29, 2018. 

Maillefer's continuous goal is to push the boundaries of what is possible and to develop the extrusion technology to new heights.

As part of this, the company created Topography Scanner (in the picture), aimed at measuring extrusion process quality in real time.

Maillefer is also proud to present Smart Dosing, a consultation product that equips line operators with the peroxide and antioxidant self-dosing know-how needed to implement Smart Dosing to the CV lines.

For fiber optic cable producers, a new superior compression technology is introduced. It allows modeling the product with neural networks, and thus improves fiber length control.

Another novelty in production competence is OCC software, which monitors the cable core real time during curing process.

You will also experience demos of the Quick Conductor Splicing technology, which will provide you with faster and more reliable conductor splicing compared to conventional technology.

Last but not least, Round Premium Value Package is a true industry breakthrough for existing and new VCV lines. It includes all necessary know-how to cut down geometrical errors by half, and increases line productivity by 20-40%.

For further details and more novelties, come and see how Maillefer connects the digital and physical production worlds in booth G83 in Hall 01.